Wafer bonding at the end of the wafer processing is a common method in mems fabrication, where a kind of wafer level assembly is performed by mounting protective caps over the mechanically sensitive mems structures. Niklaus f, kumar rj, mcmahon jj, yu j, lu jq, cale. In this paper we present a new adhesive wafer bonding process that involves partially curing crosslinking of the benzocyclobutene bcb coatings prior to. In this paper, we propose an extremely simple, robust, and costeffective fabrication process for wafer level capping of mems devices and imaging sensors by adhesive wafer bonding. Gutmann1,3 1 department of electrical, computer, and systems. Besides acting as construction module, bcb and su8 have also been used to join two or more wafers 45. A report is presented on the optical propagation loss of waveguides based on inp nanowires embedded in a benzocyclobutene matrix and fabricated through a wafer bonding process. Presented is a novel process of benzocyclobutene bcb bonding for a wafer level package with stamp printing, in which the bcb structure is transferred and patterned by pressing the cap wafer towards.
This study investigated the process conditions during bonding and waveguide fabrication with a view to reducing the propagation loss. Pdf due to the flowability of benzocyclobutene bcb and the unavoidable shear components of the bonding force applied by bonding facilities, it is. Indirect wafer bonding and epitaxial transfer of gasb. Osa thinfilm devices fabricated with benzocyclobutene. Benzocyclobutene bcb 402235 polymer thin films by spin. Application benzocyclobutene was used as the adhesive bonding material in adhesive waferlevel bonding technique. Adhesive wafer bonding for waferlevel fabrication of. Pdf voidfree bcb adhesive wafer bonding with high alignment. Low temperature wafer level bonding using benzocyclobutene. Monolithic integrated circuits, threedimensional integrated circuits, wafer bonding, wafer scale integration. Reliability study of wafer bonding for microelectro. Highthroughput multiple diestowafer bonding technology.
Photosensitive benzocyclobutene has been widely used as dielectric material in. However, due to the decreased flow capability of that material after exposure, high bond forces and extended bonding times during wafer bonding as well as nearly flat surfaces with low topography are. Specifically adhesive wafer bonding with benzocyclobutene bcb and the negative photoresist. This seals the functional cavities, to stabilize chips or to apply other functional elements such as optical windows figure 33. Although the bonding strength of bcb is satisfactory with the assist of adhesion promoter, it is found that bcb. To microelectronic engineers, bcb stands for benzocyclobutene, a polymeric material that combines bonding capability with appropriate electronic properties for chip manufacturing. Pdf thinfilm devices fabricated with benzocyclobutene. Selective wafer level adhesive bonding with benzocyclobutene.
A conceptual schematic of the viafirst approach is illustrated in figure 1. Low temperature wafer bonding is a powerful technique for memsmoems devices fabrication and packaging. Bcbbased polymer dielectrics may be spun on or applied to a variety of. This technology allows to fabricate a variety of reliable waferbonded components in a fairly simple. Wafer bonding with bcb and su8 for mems packaging ieee xplore. Adhesive wafer bonding using a molded thick benzocyclobutene layer for wafer level integration of mems and lsi m makihata1, s tanaka1, m muroyama1, s matsuzaki1, h yamada2, t nakayama2, u yamaguchi2,kmima2, y nonomura3, m fujiyoshi3 and m esashi1 1 tohoku university, japan 2 toyota motor corp. Due to the flowability of benzocyclobutene bcb and the unavoidable shear components of the bonding force applied by bonding facilities, it is quite challenging to achieve voidfree bcb adhesive bonding. Among the low temperature processes adhesive bonding focuses a high technological interest. The introduction of bcb benzocyclobutene, dryetchable polymers, makes it possible to pattern the adhesive layer in a similar fashion with the rest of the bulk material. Niklaus f, stemme g, lu jq, gutmann rj 2006a adhesive wafer bonding.
Bcb is emerging as an attractive bonding adhesive for wafer bonding in 3d integration. Bcb wafer bonding compatible with bulk micro machining. For convenience, a silicon wafer 100 is used as the substrate. Adhesive bonding also referred to as gluing or glue bonding describes a wafer bonding technique with applying an intermediate layer to connect substrates of different types of materials. Thinfilm devices fabricated with benzocyclobutene adhesive wafer bonding. However, the conditions of the bonding and fabrication process strongly affect the propagation loss of waveguides. Adhesive wafer bonding for mems applications request pdf. The emergence of benzocyclobutene in bonding electronics. Delamination of bonding interface between benzocyclobutene. Based on the aforementioned w2w bonding method, we propose an alternative proprietary highthroughput multiple d2w bonding method. Specific details of a hybrid metalpolymer wafer bonding.
Benzocyclobutene bcb is a benzene ring fused to a cyclobutane ring. Structure release and chip separation are realized by throughwafer. Silicon wafer to be coated with benzocyclobutene bcb 402235 resin should. The 3d structure is produced by lowtemperature bonding of two preprocessed silicon wafers using the benzocyclobutene bcb polymer. Michael gallagher, jonguk kim, eric huenger, kai zoschke, christina lopper, and michael toepper 2012 low temperature wafer level bonding using benzocyclobutene adhesive. Voidfree bcb adhesive wafer bonding with high alignment. Bcb adhesive bonding has been identified as the preferred wafer. Results from a study of indirect wafer bonding and epitaxial transfer of gasbbased materials are presented. Wafer bonding with adhesive glue is a process based.
Integration of benzocyclobutene polymers and silicon micromachined structures using anisotropic wet etching nima ghalichechian, alireza modafe, and reza ghodssia mems sensors and actuators lab. Benzocyclobutene bcb was used as a bonding agent to bond gasb and epitaxial. Osa ultrathin dvsbcb adhesive bonding of iiiv wafers. Bcbbased polymer dielectrics may be spun on or applied to various substrates for use in micro electromechanical systems mems and microelectronics processing. Threedimensional inpdhbt on sigebicmos integration by means of benzocyclobutene based wafer bonding for mmwave circuits. Benzocyclobutene is a strained system which, upon heating to approximately 180. Physical on deepdyve, the largest online rental service for scholarly. A variety of polymers have been explored as thinfilm adhesives for wafer bonding. This technology allows to fabricate a variety of reliable waferbonded.
Aligned wafertowafer bonding with dielectric polymer layers e. Rfmems packaging technique using benzocyclobutene bcb seonho seok, romain crunelle, michel fryziel, nathalie rolland, paulalain rolland. Applications include wafer bonding, optical interconnects, low. In this paper, we propose an extremely simple, robust, and costeffective fabrication. Laser direct patterning of dry etch bcb adhesive layers. Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding e.
Two bonding technologies are used to realize the iii. Integration of benzocyclobutene polymers and silicon. Ultra i310 as the intermediate bonding material is described. Wafer bonding at the end of the wafer processing is a common method in mems fabrication, where a kind of wafer level assembly is performed by mounting protective caps over the mechanically sensitive. It has chemical formula c 8 h 8 bcb is frequently used to create photosensitive polymers. The patterning of this material was done either by dry etching of the bcb or by using a photosensitive. Costefficient waferlevel capping for mems and imaging. Rfmems packaging technique using benzocyclobutene bcb. Benzocyclobutene bcb is used to create photosensitive polymers, which require fewer processing steps than dry etch materials. Adhesive wafer bonding using a molded thick benzocyclobutene layer for waferlevel integration of mems and lsi m makihata1, s tanaka1, m muroyama1, s matsuzaki1, h yamada2, t nakayama2, u.
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